The XINTAO 99 High Alumina Support Media is equal Denstone® 99 Support Media. It is inchemical composition99+% alpha alumina and a maximum 0.2wt% SiO 2 . Because of its highalumina content and low silica (SiO2 ), it's a very excellent and ideal product for high temperature and steam applications, such as secondary reformers in ammonia processing, where leached silica will coat downstream equipment or foul the catalyst bed.
The XINTAO 99 High Alumina Support Media has very excellent thermal properties, with its high density high-temperature resistance 1550℃, also it's a good choice for heat retention or equilibration media.
For its superior chemical resistance, it's suitable for applications in olefin processes, such as ethylene dryers, where there's the polymerization problem.
Model: |
XINTAO 99 |
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Color: |
White |
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Shape: |
Ball |
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Typical Technical Composition |
Min. % |
Max. % |
Usual % |
||
SiO2 |
****** |
0.2 |
0.18 |
||
Al2O3 |
99 |
99.6 |
99.3 |
||
Fe2O3 |
****** |
0.2 |
0.02 |
||
TiO2 |
****** |
0.55 |
0.02 |
||
CaO |
****** |
0.1 |
0.2 |
||
MgO |
****** |
0.1 |
0.05 |
||
Na2O |
****** |
0.25 |
0.1 |
||
K2O |
****** |
0.2 |
0.13 |
||
Physical properties |
|||||
Index |
Value |
||||
Leachable Iron |
≤ 0.01% |
||||
Apparent Porosity by Weight |
≤ 7.0% |
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Moh's Hardness Scale |
>8.0 |
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Water Absorption |
<4.0wt.% |
||||
Acid Resistance |
>99.8% |
||||
Thermal Conductivity |
0.7-0.8 w/m2 .k |
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Thermal Expansion @ 500℃ |
0.10% |
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Max. Operating Temperature |
1550°C |
2822 |
|||
Specific Density |
3.4g /cm3 |
212 lb /ft3 |
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Bulk Density (Packing Density) |
2.1g /cm3 |
131 lb /ft3 |
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Size / |
Crush Strength |
||||
Nominal Size |
(lbs) |
(kg) |
(N/pc) |
||
mm |
inch |
min. |
min. |
min. |
|
3 |
1/8" |
115 |
52 |
510 |
|
6 |
1/4" |
230 |
105 |
1030 |
|
10 |
3/8" |
440 |
200 |
1961 |
|
13 |
1/2" |
1355 |
615 |
6031 |
|
16 |
5/8" |
1720 |
780 |
7650 |
|
19 |
3/4" |
2315 |
1050 |
10297 |
|
25 |
1" |
3130 |
1420 |
13925 |
|
38 |
1-1/2" |
4034 |
1830 |
17946 |
|
50 |
2" |
4960 |
2250 |
22065 |
Derechos de autor © Jiangxi Xintao Technology Co., Ltd. | Reservados todos los derechos
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